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The largest U.S. maker of memory chips, Micron manufactures and sells various types of DRAM and NAND memory used in everything from PCs and smartphones to automobiles and data centers. Founded in the basement of a Boise dental office in 1978, the company has grown into a leader in both semiconductor R&amp;D and manufacturing, with more than 15,000 active U.S. patents and 7,500 active foreign patents to its name and a string of chip manufacturing facilities throughout the U.S. and Asia. The company announced plans in 2022 to construct a “megafab” in upstate New York, promising to spend $100 billion on the project over a period of 20 years.

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Micron Technology (MU): Company Profile, Stock Price, News, Rankings

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Micron Technology

micron technology

As a reminder, today's program is being recorded. And now I'd like to introduce your host for today's program, Satya Kumar, Corporate Vice President, Investor Relations and Treasury. Please go ahead, sir.

Thank you, and welcome to Micron Technologies' fiscal second quarter twenty twenty five financial conference call. On the call with me today are Sanjay Mehrotra, our Chairman, President and CEO and Mark Murphy, our CFO. Today's call is being webcast from our Investor Relations site at investors.micron.com, including audio and slides. In addition, the press release detailing our quarterly results has been posted on the website along with prepared remarks for this call. Today's discussion of financial results is presented on a non GAAP financial basis unless otherwise specified.

A reconciliation of GAAP to non GAAP financial measures can be found on our website. We encourage you to visit our website at micron.com throughout the quarter for the most current information on the company, including information on financial conferences that we may be attending. You can also follow us on xmicrontech. As a reminder, the matters we are discussing today include forward looking statements regarding market demand and supply, including demand for our products, our market share, market pricing and cost trends and drivers, our plans for manufacturing, the impact of developing technologies such as AI, product ramp plans, technologies and market position, expected capabilities of our future products, our planned investments and expenditures, our expected results and guidance, regulatory matters and other matters. These forward looking statements are subject to risks and uncertainties that may cause actual results to differ materially from statements made today.

We refer you to documents we filed with the SEC, including our Form 10 K, Forms 10 Q and other reports and filings for a discussion of risks that may affect our future results. Although we believe that the expectations reflected in the forward looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements. We are under no duty to update any of the forward looking statements to confirm these statements to actual results. I will now turn the call over to Sanjay.

Thank you, Satya. Good afternoon, everyone. Micron is in the best competitive position in our history and we are achieving share gains across high margin product categories in our industry. Our strong product momentum has enabled us to build deeper customer relationships and Micron's industry leading products are now more firmly entrenched in our customers' high value product roadmaps. In fiscal Q2, data center DRAM revenue reached a new record.

HBM revenue grew more than 50% sequentially to a new milestone of over $1,000,000,000 of quarterly revenue. Our HBM shipments were ahead of our plans, demonstrating strong execution of our ongoing ramp. The combination of our revenue from high capacity DRAM modules and our industry leading LP DRAM for the data center also exceeded the $1,000,000,000 milestone for the quarter. Micron remains the only company in the world to shift low power DRAM into the data center in high volume, showcasing our pioneering innovation and deep partnership with our customers for differentiated solutions. As we build on this momentum, we expect fiscal Q3 revenue to be another record for Micron, driven by shipment growth across both DRAM and NAND.

We see the combination of AI data center demand and the ramp of HBM and its associated trade ratio contributing to tightness at the leading edge and constraining non HBM DRAM supply. We expect supply actions announced by NAND companies to improve the dynamics in the NAND market. Micron's one beta DRAM technology leads the industry and we are extending our leadership with the launch of our One Gamma node and the industry's first shipments of One Gamma based D5 products last month. Micron's One Gamma is our first DRAM node incorporating EUV

have achieved 20% lower power, 15% better performance and over 30% improvement in bit density compared to our one beta DRAM. Micron's leading edge Gen nine NAND technology node delivers the industry's fastest TLC based NAND and we are managing the ramp of this node mindful of the supply demand balance in the industry. Micron continues to make disciplined investments that position us to capitalize on the significant growth opportunities driven by AI. We are focused on growing HBM capacity in our existing manufacturing facilities to meet requirements through 2026. In January, we broke ground on an HBM advanced packaging facility in Singapore.

This investment allows us to meaningfully expand our total advanced packaging capacity beginning in calendar twenty twenty seven. Our new DRAM fab construction in Idaho completed an important construction milestone that enabled the receipt of the first disbursement of funding from our CHIPS grant for the project during the quarter. This new Idaho fab will provide meaningful DRAM output starting in fiscal twenty twenty seven. Turning to our end markets. Dramatic improvements in computation hardwares have reduced the per token cost of generative AI models.

These hardware improvements along with more efficient algorithms and software drive down the cost of inference and make generative AI based capabilities more accessible to new applications and use cases. This broadening deployment creates a powerful growth vector for aggregate AI demand and recent innovations and those in the pipeline, some key contributors to the AI ecosystem will continue to fuel this growth trend. As GPU and custom AI accelerator performance capabilities continue to improve with each new generation of product, these high performance processors are starved of memory bandwidth. HVM memory provides the bandwidth necessary to leverage these powerful processors in the most effective and efficient manner and we are excited to see the growth opportunities ahead for this complex and high value product category where our customers now recognize Micron as the HBM technology leader in our industry. Recently, large hyperscale customers reiterated strong year over year growth for their capital investments in calendar twenty twenty five.

We project mid single digit server unit growth in calendar twenty twenty five with growth in both traditional and AI servers. We see strong demand for HBM and have once again increased our HBM TAM estimate for calendar twenty twenty five to over $35,000,000,000 We remain on track to reach HBM share similar to our overall DRAM supply share on a run rate basis in calendar Q4 '20 '20 '5. As previously mentioned, Micron is sold out of our HBM output in calendar twenty twenty five. We are seeing strong demand for our HBM supply in 2026 and are in discussions with our customers on agreements for their calendar twenty twenty six HBM demand. Micron's industry leading HBM3e delivers a 30% power reduction compared to the competition and our HBM3e 12 high has a remarkable 20% power advantage over competing eight high products, while providing a 50% higher memory capacity.

We have begun volume production of HBM3e 12 high and are focused on ramping capacity and yield. We anticipate HBM3e 12 high will comprise the vast majority of our HBM shipments in the second half of calendar twenty twenty five. We are making good progress on additional platform and customer qualifications with HBM. Micron's HBM3e eight high is designed into NVIDIA's GB200 system and our HBM3e 12 high is designed into the GB300. In fiscal Q2, we initiated volume shipments to our third large HBM CE customer and anticipate additional customers over time.

We expect multi billion dollars in HBM revenue in fiscal twenty twenty five. Looking ahead, we are enthusiastic about Micron's HBM4, which will ramp in volume in calendar twenty twenty six. Our HBM4 provides a bandwidth increase of over 60% compared to HBM3e. The timing of our HBM4 is aligned to our customers' requirements and we are focused on delivering the best HBM4 products to the market across power efficiency, quality and performance. Our proven HBM product performance, our strong HBM roadmap and our demonstrated manufacturing excellence uniquely position Micron to capitalize on next generation HBM4 and HBM4e solutions.

Micron has led the adoption of LP in data center. In AI servers, Micron's LP lowers memory power consumption by over two thirds compared to D5. We expect to maintain our leadership position in LP for server as it transitions from soldered components to a SOCAM or small outline compression attached memory module form factor. Micron SOCAM was developed in collaboration with NVIDIA to support the GB300. LP DRAM in a SOCAM form factor enables easier server manufacturability and serviceability and helps drive broader LP adoption in the server market.

We are on track to deliver multibillion dollars in revenue in fiscal twenty twenty five from our portfolio of high capacity D5 modules and LP products for the data center. In data center NAND, demand moderated in fiscal Q2 due to short term customer inventory driven impacts and we see a return to bit shipment growth in the months ahead. In calendar Q4 twenty twenty four, based on industry analyst reports, Micron achieved yet another record high market share in datacenter SSDs with revenue growth in each category, including performance, mainstream and capacity SSDs. Our high performance 9,550 SSD, which is on NVIDIA GB200 NVL72 approved vendor list, completed qualifications at multiple customers. During the quarter, we announced that Micron's data center class G8 QLC based NAND components are qualified for production in pure storages high capacity 150 terabyte direct flash module.

Micron's data center class NAND components give customers the ability to leverage our industry leading NAND design and process technology in their custom storage solutions. Micron's leadership in QLC NAND supports the transition from HDD to NAND solutions in the data center. We expect to generate multiple billions of dollars in data center NAND revenue and once again grow our data center NAND market share in calendar twenty twenty five. We expect the PC market to grow mid single digits in unit terms in calendar twenty twenty five with growth weighted to the second half of calendar twenty twenty five. The Windows 10 end of life in October 2025 combined with an aging installed base and the desire amongst customers to ensure that their PC hardware specs can support compelling AI applications in the future are key catalysts that drive this growth.

AI PCs require a minimum of 16 gigabyte of DRAM with many models requiring even higher memory versus the average 12 gigabyte PC content last year. During the quarter, we sampled our 16 gigabyte one gamma based D5 products to PC clients. In NAND, we launched our Gen nine based 4,600 performance SSDs, the fastest in the world for the client market and completed qualifications of our 2,650 mainstream SSDs at multiple PC OEMs. Turning to mobile, our expectations for smartphone unit volume growth in calendar twenty twenty five remain at low single digit percentages. Smartphone customer inventory dynamics have played out as anticipated leading to mobile DRAM and NAND bit shipment growth in our fiscal Q3.

AI adoption continues to be a significant driver for increased mobile DRAM demand. AI capable flagship chip phones increasingly feature DRAM capacities of 12 gigabyte or higher compared to the eight gigabyte in last year's models. Smartphone OEMs are using Micron's industry leading 9.6 gigabit per second LP5X DRAM to improve AI performance, delivering up to 20% more tokens per second than those using legacy speed grades on the same SoC. During the quarter, we announced that our LP5x DRAM and UFS four point zero NAND were featured in the high end of the Samsung Galaxy S25 series. Micron's mobile DRAM and UFS storage solutions are in high demand and will continue to launch in flagship and high end smartphones throughout the year.

Additionally, we are now sampling the industry's first mobile G9 managed NAND based UFS 4.1 solution in densities up to one terabyte. Automotive OEMs, industrial and consumer embedded customers are in the later stages of adjusting their inventory levels. In automotive, which comprises the largest portion of our EBU revenue, memory and storage content per car continues to increase as AI enabled in vehicle infotainment systems become more enriched and driver assistance functions become more capable. Advanced robotaxi platforms today contain over 200 gigabyte of DRAM or 20 to 30 times higher than the amount of DRAM in the average car. Micron is well positioned to capitalize on this trend with our industry leading portfolio of automotive products.

During the quarter, we announced the production readiness of the industry's first automotive LP5X DRAM product that supports a 9.6 gigabit per second speed grid, addressing the increasing performance requirements of AI driven applications in vehicles. Additionally, our 4,150 SSD became the industry's first enterprise SSD product that is automotive qualified and is now sampling at target customers further reinforcing our commitment to innovation and leadership in this important market. Now turning to our market outlook. Calendar 2024 DRAM bit demand growth was in the high teens, consistent with our prior expectations. Calendar 2024 NAND bit demand growth was approximately 10%, slightly below our previous view of low double digits.

We forecast calendar '20 '20 '5 DRAM bit demand growth in the mid to high teens percentage range and NAND in the low double digit percentage range. Over the medium term, we expect industry bit demand growth of mid teens CAGR for both DRAM and NAND. As we have previously discussed, NAND technology transitions provide a significant increase in overall bit output. Sustained NAND industry supply demand balance can result from increasing the time between node transitions along with sustained reductions in NAND industry CapEx and wafer capacity. NAND industry wafer capacity underutilization can help to improve the near term dynamics in the NAND market.

We expect Micron's supply growth in calendar twenty twenty five to be lower than industry demand growth for both DRAM and NAND. We expect our inventory days to decline as we move through calendar twenty twenty five. We expect to maintain our bit share in DRAM and NAND in calendar twenty twenty five. In DRAM, we expect a strong ramp of HBM throughout calendar twenty twenty five. As noted before, HBM3e consumes three times the amount of silicon compared to D5 to produce the same number of bits.

Looking ahead, we expect the trade ratio to increase with HBM4 and then again with HBM4E when we expect it to exceed four:one. This sustained and significant increase in silicon intensity for the foreseeable future contributes to tightness for the industry leading edge node supply and constraints capacity for non HBM products. In NAND, we continue to underutilize our fabs and our wafer output is down mid teens percentage from prior levels. We plan to reuse a portion of our underutilized NAND equipment to support capital efficient conversions to leading edge nodes. This strategy results in over 10% structural reduction of NAND wafer capacity exiting fiscal twenty twenty five compared to levels exiting fiscal twenty twenty four.

We will continue to prudently manage our DAN supply, including the levels of our capital investment, the pace of ramp of our new technology node, fab capacity and utilization consistent with our demand growth. Our capital spending plans remain unchanged at approximately $14,000,000,000 for fiscal twenty twenty five. A significant portion of our capital investments are focused on multi year facility investments to support our DRAM and HBM manufacturing, including our Idaho fab, Singapore HBM advanced packaging facility and Taiwan DRAM test facility. Micron will remain disciplined with our overall equipment investments to manage our supply growth consistent with demand. On tariffs, Micron serves as a U.

S. Importer of record for a very limited volume of products that would be subject to newly announced tariffs on Canada, Mexico and China. We continue to monitor the possibility of future tariffs and are prepared to work with our customers and suppliers to understand future tariff effects and supply chain auctions that may arise. Where tariffs do have an impact, we intend to pass those costs along to our customers. With that, I will now turn it over to Mark for our financial results and outlook.

Thank you, Sanjay, and good afternoon, everyone. Micron delivered fiscal Q2 EPS above the guidance range and revenue and gross margin within the range. Total fiscal Q2 revenue was approximately $8,100,000,000 down eight percent sequentially and up 38% year over year. Fiscal Q2 DRAM revenue was $6,100,000,000 up 47% year over year and represented 76% of total revenue. Sequentially, DRAM revenue decreased 4% with bit shipments decreasing in the high single digit percentage range and prices increasing in the mid single digit percentage range as a result of improving portfolio mix.

Fiscal Q2 NAND revenue was $1,900,000,000 up 18% year over year and represented 23% of Micron's total revenue. Sequentially, NAND revenue decreased 17% with bit shipments modestly higher and prices decreasing in the high teens percentage range. Fiscal Q2 bit NAND bit shipments were above our expectations, driven by higher consumer oriented shipments. Now turning to revenue by business unit. Compute and networking business unit revenue was up 4% sequentially to 4,600,000,000 and reached 57% of our total revenue.

For the third consecutive quarter, CMBU revenue reached a new quarterly record, driven by a more than 50% sequential increase in HBM revenue. Revenue for the storage business unit was $1,400,000,000 down 20% sequentially. Decline in SBU revenue was driven primarily by lower storage investments from data center customers after several quarters of very strong growth and overall NAND industry pricing. Mobile business unit revenue was $1,100,000,000 down 30% sequentially, as mobile customers continued to improve their inventory positions. Embedded business unit revenue was $1,000,000,000 down 3% sequentially.

Lower sequential revenue was primarily due to inventory improvement initiatives at automotive customers. The consolidated gross margin for fiscal Q2 was 37.9% down 160 basis points sequentially due primarily to pricing and consumer oriented segments of the market, especially in NAND and NAND mix shift to consumer oriented products as mentioned earlier. Our ongoing high value mix shift in our DRAM portfolio partially offset some of these factors. Operating expenses in fiscal Q2 were $1,000,000,000 flat sequentially. R and D expenses were lower than planned due to earlier product qualification and timing of certain R and D projects.

We generated operating income of $2,000,000,000 in fiscal Q2, resulting in an operating margin of 24.9%, which was down approximately two sixty basis points sequentially and up 21 percentage points from a year ago quarter. Fiscal Q2 adjusted EBITDA was $4,100,000,000 resulting in an EBITDA margin of 50.7%, up 10 basis points sequentially and up 14 percentage points or $2,000,000,000 from the year ago quarter. Fiscal Q2 taxes were $214,000,000 on an effective tax rate of 10.7%, lower than our guidance due to the effects of one time items in the quarter. Non GAAP diluted earnings per share in fiscal Q2 was 1.56 above the high end of the guidance range compared to $1.79 per share in the prior quarter and $0.42 in the year ago quarter. Turning to cash flows and capital spending, in fiscal Q2, our operating cash flows were over 3,900,000,000 and our capital expenditures were $3,100,000,000 net of proceeds from government incentives.

As a result, free cash flows in the quarter were $857,000,000 Our fiscal Q2 ending inventory was $9,000,000,000 or 158 days, up as communicated previously, and an increase of nine days from the prior quarter. On the balance sheet, we held $9,600,000,000 of cash and investments at quarter end and maintained $12,100,000,000 of liquidity when including our untapped credit facility. During fiscal Q2, we extended our debt maturities through a $1,000,000,000 10 year senior note offering and a $1,700,000,000 term loan with proceeds principally used to pay down notes maturing in 2026 and the previous term loan balance. We ended the quarter with 14,400,000,000 in total debt, low net leverage and a weighted average maturity on our debt of 2,032. Following quarter end, we renewed and increased the size of our five year revolving credit facility to $3,500,000,000 This provides an additional $1,000,000,000 of liquidity and further improves our financial flexibility.

Now turning to our outlook for the third fiscal quarter. We forecast growth in DRAM and NAND bit shipments in fiscal Q3. We forecast sequentially lower fiscal Q3 gross margin, which includes the effects of higher consumer oriented volumes. NAND underutilization continues to weigh on gross margins. We project operating expenses in fiscal Q3 to be approximately $1,130,000,000 and fiscal twenty twenty five OpEx to increase by over 10%, reflecting planned increases to support our portfolio of high value products, including HBM.

We expect EIO to decrease in the third fiscal quarter on higher bit shipments. We continue to project ending fiscal twenty twenty five with tight DRAM inventories. For fiscal Q3 and Q4, we estimate our non GAAP tax rate to be approximately 14%. In fiscal Q3, we forecast CapEx to be over $3,000,000,000 Our CapEx projection for fiscal twenty twenty five remains approximately $14,000,000,000 dollars The overwhelming majority of the fiscal twenty twenty five CapEx is to support HBM as well as facility, construction, back end manufacturing and R and D investments. Impacts from potential new tariffs are not included in our guidance given the uncertainty around tariff timing, nature and implementation.

With all these factors in mind, our non GAAP guidance for fiscal Q3 is as follows: We expect revenue to be $8,800,000,000 plus or minus $200,000,000 gross margin to be in the range of 36.5% plus or minus 100 basis points and operating expenses to be approximately $1,130,000,000 plus or minus $15,000,000 As mentioned, we expect the fiscal Q3 tax rate to be around 14. Based on a share count of approximately 1,140,000,000.00 shares, we expect EPS to be $1.57 per share plus or minus $0.1 In fiscal Q2, Micron delivered earnings above guidance range, achieved record revenues again in data center DRAM, ramped our leading HBM and released the industry's most advanced DRAM process technology. For fiscal Q3, we project record quarterly revenue at the midpoint of our guidance. We are focusing our R and D resources, exercising capital discipline and maintaining a strong balance sheet as we extend our leadership and tap into substantial growth opportunities ahead. I will now turn it back over to Sanjay.

Thank you, Mark. Micron is uniquely positioned to capitalize on the transformative growth driven by AI from data center to edge devices, and we are on track for the record revenue and significantly improved profitability in fiscal twenty twenty five. We are confident in our ability to navigate the current market dynamics with disciplined investments and a focus on our high value portfolio mix shift. This is the most exciting time I have seen for memory and storage and Micron's innovations are at the forefront of this revolution. We are excited about the opportunities ahead and remain committed to delivering value for all our stakeholders.

Thank you for joining us today. We will now open for questions.

Certainly. And our first question for today comes from the line of Harlan Sur from JPMorgan. Your question please.

Yes, good afternoon. Thanks for taking my question. Back in mid February at an investor conference, I know the team had walked us through the dynamics on a weaker gross margin profile during the May that's playing out, but you did anticipate an improved gross margin profile beyond this quarter fiscal Q3. So is that still the case that we should see gross margin improvements maybe starting in fiscal Q4 and potentially beyond? And is that across both data center and your consumer related products?

Is that across total DRAM and your NAND segments? Any color here would be great.

Sure, Harlan. This is Mark. I'll take that. So let me just make some comments about the third quarter. It is down sequentially as we had indicated in the conference.

And again, as we said in the conference, down primarily due to higher mix of consumer oriented volumes, lower CQ1 pricing on consumer oriented markets and industry and income just generally, all that partially offset by higher HBM. We do see while down conditions have improved since those public comments and the updated view is reflected in the guide today. Now we're not providing guidance on the fourth quarter. However, we do expect gross margin to be up somewhat. There's always tailwinds and headwinds.

As you know on tailwinds, we do expect market conditions to improve. We do expect HBM and other high value products to grow and contribute to mix improvement. Some headwinds, we do see NAND underutilization as we talked about. And actually since our capacity has come down structurally, we're going to see less of those costs in the third quarter on period and see more of those costs get us as inventory clears in the fourth quarter. It's still we've taken actions to manage the NAND supply and that's important and that part of the business is still getting its legs back under it, but we intend to take price action in the second quarter calendar and just maintain work to maintain supply discipline.

And then we are going to see in fourth quarter the beginning of some startup costs related to construction activities and new node in DRAM that we're working. So in short, we would expect fourth quarter margins to be up somewhat from third quarter.

I appreciate that. And then Sanjay, you increased your industry bit demand outlook from mid teens last earnings to mid to high teens this quarter for calendar twenty twenty five for DRAM. I assume part of it is the HBM related dynamics as you increase your TAM outlook for HBM this year, but is the team seeing any other segments within DRAM that are driving the better industry bit demand profile as the year unfolds?

We had projected that customer inventories will get in a better place by spring timeframe in the consumer side of the business. And it's turning out to be the way we had projected. And of course, the smartphone and PC markets are also seeing more and more devices that have AI implemented that drives content growth. So, as customer inventories got closer to healthier levels, we are seeing resumption of purchases by customers and all that plays into our guide for twenty twenty five bit demand. And as you noted, of course, data center continues to be strong.

And in data center, of course, HBM is a strong contributor toward revenue growth. In terms of bit demand growth for data center, of course, high density DIMMs, as well as LP where Micron leads the industry, all of these actually contributing toward the demand increase in 2025 as well.

Thank you. And our next question comes from the line of Timothy Arcuri from UBS. Your question please.

us a little detail on the fiscal Q3 guidance? You're guiding revenue up about $750,000,000 How much of that's coming from DRAM versus NAND? And I know you said that bits are up in both, but can you give us a sense of how much bits are up in each of those two markets? Thanks. And then I had another question as well.

Yes. Tim, we've provided you the consolidated revenue number. You have the year to date figures on both revenue and DRAM or revenue and bit growth and price for both DRAM and NAND. And then we've provided you a demand growth for the year in bits. So I think we've provided you the contours of the business and you should be able to make some volume and price assumptions on the revenue outlook.

We do expect bit growth in both DRAM and NAND in third quarter.

Okay. But I guess, Mark, can you say that you expect revenue growth in both DRAM and NAND as well?

DRAM with the HBM and data center exposure will be the bias of growth will be there.

Okay, cool. Thanks. And then, so Mark, I mean, obviously, everything you're doing here is great. I think the bugaboo obviously is margins are still a bit low certainly into the fiscal Q4. So I guess I have like a two part question.

One, I know you don't want to guide fiscal Q4 margins, but do you think you can get back to what you just did in fiscal Q2, in fiscal Q4? And I guess broadly, when is this stuff clear and sort of we begin to see the true goodness flowing through from HBM and from all the cost downs you're doing on the non HBM DRAM side? So sort of when do we start to get kind of a clean gross margin number if you will? Thanks.

Tim, we're not going to provide a fourth quarter number. We have indicated that fourth quarter gross margins would be up somewhat from third quarter. I think as Sanjay mentioned in prepared remarks, we're in the best position we've ever been in on technology and market exposure products. Manufacturing is operating very well. On the cost side, maybe to help you with the modeling, our all in DRAM costs for fiscal year 2025, we expect to be flattish.

Our all in NAND costs for FY 2025 in line with front end costs reductions in the low double digits. So we are taking supply actions on the NAND side, consists of underloading, reducing CapEx, delaying node transitions as we talked about, and we're beginning to see some signs of improvement on that part of the business. On the DRAM side of business, we know the continued HBM growth and broader data center. And then the lead edge on DRAM is tight and we're again projecting our DIO levels to be below our target by the end of the fiscal year.

And Tim, I'll just add that of course we continue to be focused on increasing the mix of our revenue towards higher profit pools of the industry, both in DLAM and NAND. So, in terms of our product portfolio, as we have said, it is best positioned. So, continue to drive the product portfolio and mix focusing on really strengthened profitability. And demand trends we have talked about, I mean, we feel good about DRAM demand trend and of course in NAND, the supply discipline will be important. We of course are extremely focused on that and AI is benefiting our DRAM demand across data center and edge as well.

And of course, our technology position, our product position and our cost position continues to be healthy.

Thank you. And our next question comes from the line of Chris Sanker from TD Cowen. Your question please.

I have two of them. First, Sanjay or Mark, you've seen some of the

in Q of late. I'm just wondering how much of that is true end demand versus actually tariffs related pull ins and how sustainable do you think the industry pricing dynamics today are?

Of course, as we have indicated, the DRAM demand drivers as well as NAND on the consumer side of the business in smartphones, particularly in smartphones, as well as in PCs are improving as the customers are getting closer to their normal inventory levels in the consumer markets. Again, along the lines of what we had projected. PC probably more second half of this year that we start seeing a greater demand trend with respect to AI PCs and increasing penetration of AI PCs. AI PCs require greater DRAM content than what was in the past. We have talked about that last year average 12 gigabyte in PCs and AI PCs with NPU running at 40 DOBs or higher requires 16 gigabyte or higher.

So these are good demand trends on the PC side and same thing happening on the smartphone side. You have seen several introductions and more of these of smartphones and more of them to be rolling out with AI smartphones that too have higher DRAM content greater than 12 gigabyte versus last year at eight gigabyte. And of course, data center demand trend in DRAM continues to be strong as well. So all of this, I mean, first of all, demand trends are in a good place. And of course, on the supply side, leading edge supply, as we mentioned in the prepared remarks, as well as Mark just mentioned, leading edge DRAM supply is tight.

And certainly that is happening because of increasing demand for HBM and HBM trade ratio. And on NAND, the supply actions by various players and under utilization in the fabs as certainly is improving the supply picture as well. So all of this is improving the demand supply environment in the industry. And of course, we are well focused on driving an inflection toward higher pricing in cQ2 and we are well positioned with our products across the end market segments. And we really look forward to continuing to maximize the opportunities for our business and continue to increase the mix of our business toward higher profit pools of the industry.

Micron Technology (MU) Q2 2025 Earnings Call Transcript

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